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Xpeed 3 Step Metal Chip Polishing Pad – 4 in., Metal Chip Bond, Wet
$16.00
Sale price
$16.00
Regular price
The Xpeed 3 Step Metal Chip Polishing Pad is a 4 in. wet polishing pad with a metal-chip bond, Step 0 — the coarse pre-step — in Xpeed's metal-chip polishing system.
Key Features
- 4 in. diameter, Step 0 of the V0–V3 position system
- Metal-chip bond for aggressive initial abrasive action
- Wet use
Who Is This For?
Fabricators who need an aggressive coarse pre-step ahead of finer polishing steps in the same metal-chip system.
This is a metal-chip bond pad, not a vitrified one — older listings for this SKU used the word "VITRIFIED," which does not appear anywhere in Xpeed's catalogue, and called it a "disc" rather than a pad.
Frequently Asked Questions
What kind of bond does this pad use?
A metal-chip bond, not a vitrified bond.
What step is this in the system?
Step 0, the coarse pre-step of the V0–V3 metal-chip line.
Is it for wet or dry use?
Wet use.