Xpeed 3 Step Metal Chip Polishing Pad – 4 in., Metal Chip Bond, Wet

Xpeed 3 Step Metal Chip Polishing Pad – 4 in., Metal Chip Bond, Wet

0
$16.00
Sale price  $16.00 Regular price 
Skip to product information
Xpeed 3 Step Metal Chip Polishing Pad – 4 in., Metal Chip Bond, Wet

Xpeed 3 Step Metal Chip Polishing Pad – 4 in., Metal Chip Bond, Wet

$16.00
Sale price  $16.00 Regular price 
POSITION

The Xpeed 3 Step Metal Chip Polishing Pad is a 4 in. wet polishing pad with a metal-chip bond, Step 0 — the coarse pre-step — in Xpeed's metal-chip polishing system.

Key Features

  • 4 in. diameter, Step 0 of the V0–V3 position system
  • Metal-chip bond for aggressive initial abrasive action
  • Wet use

Who Is This For?

Fabricators who need an aggressive coarse pre-step ahead of finer polishing steps in the same metal-chip system.

This is a metal-chip bond pad, not a vitrified one — older listings for this SKU used the word "VITRIFIED," which does not appear anywhere in Xpeed's catalogue, and called it a "disc" rather than a pad.

Frequently Asked Questions

What kind of bond does this pad use?

A metal-chip bond, not a vitrified bond.

What step is this in the system?

Step 0, the coarse pre-step of the V0–V3 metal-chip line.

Is it for wet or dry use?

Wet use.

You may also like